New millimeter wave packaged antenna array on IPD technology

TitleNew millimeter wave packaged antenna array on IPD technology
Publication TypeConference Paper
Year of Publication2010
AuthorsCalvez C, Person C, Coupez JP, Gallee F, Ezzeddine H, Cathelin A, Belot D
Conference NameSilicon Monolithic Integrated Circuits in RF Systems (SiRF), 2010 Topical Meeting on
Date Publishedjan.
Keywordsantenna integration, BiCMOS, BiCMOS integrated circuits, CMOS integrated circuits, high-definition multimedia interface, IEEE-802.15.3, integrated antennas, integrated packaging, IPD technology, millimeter wave frequency, millimeter wave packaged antenna array, millimetre wave antenna arrays, personal area networks, SoC, system on chip, wireless HDMI

In the millimeter wave (mmWave) frequency range, the recent advances in CMOS and BiCMOS technologies make possible the integration of entire RF front-ends on the same chip (System on Chip (SoC) approach). The present challenge concerns the antenna integration within the packaging (System in Package (SiP) approach) which will support the complete analog and digital system. Integrated antennas on silicon cannot exhibit gain performances greater than 7 dBi, typically, (14 dBi as currently expected by future normalized IEEE-802.15.3c Usage Models (UM1 to UM5)). In this paper, we propose a novel antenna array combining Glass/Silicon technologies, suitable for mmWave integrated packaging and achieving the required 14 dBi gain values for applications such as Wireless HDMI (High-Definition Multimedia Interface) downloading applications.