Millimeter-wave antenna designs for 60 GHz applications: SoC and SiP approaches

TitleMillimeter-wave antenna designs for 60 GHz applications: SoC and SiP approaches
Publication TypeJournal Article
Year of Publication2011
AuthorsCalvez C, Pilard R, Person C, Coupez J-P, Gallée F, Gianesello F, Ezzeddine H, Gloria D
JournalInternational Journal of Microwave and Wireless Technologies
Volume3
Pagination179-188
Abstract

ABSTRACT Antenna on chip (AoC) and antenna in package (AiP) solutions for millimeter-wave (mmWave) applications and their characterization are presented in this paper. Antenna integration on low resistivity (LR) and high resistivity (HR) silicon substrate are expected. And, in a packaging approach, the combination of antenna on silicon with a material, which has the effect of a , allowing increasing gain is presented. In a second part, to satisfy beamforming capabilities, a hybrid integration of the antenna on silicon and glass substrates is proposed.

URLhttp://dx.doi.org/10.1017/S1759078711000213
DOI10.1017/S1759078711000213